Akrion Goldfinger Velocity
Single wafer cleaning system , 12"
single wafer product line is focused on
improving defectivity. This includes removal of particle and
residue contamination from the wafer frontside, backside
Defects are removed without physical damage to sensitive
structures and without film etching. This is accomplished
using advanced physical clean technologies – Goldfinger
Megasonics, Jetstream Nano and Backside Megasonics.
Watermark-free performance is available with Sahara dry.
The Velocity is available in 4 or 6 chamber versions, each
with stacked chambers to minimize footprint. The
technology and platform are used for particle removal (post
deposition, sensitive structures, backside and post post
CMP) and post etch/ash (FEOL and BEOL) applications.